The Resource 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility, by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng

3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility, by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng

Label
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility
Title
3D IC and RF SiPs
Title remainder
advanced stacking and planar solutions for 5G mobility
Statement of responsibility
by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Creator
Contributor
Author
Provider
Publisher
Subject
Language
eng
Cataloging source
DLC
http://library.link/vocab/creatorName
Hwang, Lih-Tyng
Index
index present
LC call number
TK5103.2
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Horng, Tzyy-sheng Jason
  • IEEE Xplore
  • John Wiley & Sons
  • Institute of Electrical and Electronics Engineers
http://library.link/vocab/subjectName
  • Mobile communication systems
  • Mobile communication systems
Label
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility, by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Instantiates
Publication
Note
Made available via IEEE Xplore Digital Library
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
Edition
1st edition.
Extent
1 online resource
Form of item
online
Isbn
9781119289654
Lccn
2018000679
Media category
computer
Media MARC source
rdamedia
Media type code
c
Note
WorldCat record--MA
Specific material designation
remote
System control number
  • (OCoLC)1019839869
  • (OCoLC)on1019839869
Label
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility, by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Publication
Note
Made available via IEEE Xplore Digital Library
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
Edition
1st edition.
Extent
1 online resource
Form of item
online
Isbn
9781119289654
Lccn
2018000679
Media category
computer
Media MARC source
rdamedia
Media type code
c
Note
WorldCat record--MA
Specific material designation
remote
System control number
  • (OCoLC)1019839869
  • (OCoLC)on1019839869

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