The Resource Advanced Flip Chip Packaging, edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, (electronic resource)

Advanced Flip Chip Packaging, edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, (electronic resource)

Label
Advanced Flip Chip Packaging
Title
Advanced Flip Chip Packaging
Statement of responsibility
edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
Creator
Contributor
Editor
Provider
Subject
Language
eng
Summary
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging
http://library.link/vocab/creatorName
Tong, Ho-Ming
Image bit depth
0
LC call number
  • TK7800-8360
  • TK7874-7874.9
Literary form
non fiction
http://library.link/vocab/relatedWorkOrContributorName
  • Lai, Yi-Shao.
  • Wong, C.P.
  • SpringerLink
http://library.link/vocab/subjectName
  • Engineering
  • Electronics
  • Systems engineering
  • Optical materials
  • Engineering
  • Electronics and Microelectronics, Instrumentation
  • Circuits and Systems
  • Optical and Electronic Materials
Label
Advanced Flip Chip Packaging, edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
Dimensions
unknown
Extent
VII, 560 p. 413 illus., 242 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781441957689
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4419-5768-9
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4419-5768-9
Label
Advanced Flip Chip Packaging, edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
Dimensions
unknown
Extent
VII, 560 p. 413 illus., 242 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781441957689
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4419-5768-9
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4419-5768-9

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