The Resource Advanced electronic packaging : with emphasis on multichip modules, (electronic resource)

Advanced electronic packaging : with emphasis on multichip modules, (electronic resource)

Label
Advanced electronic packaging : with emphasis on multichip modules
Title
Advanced electronic packaging
Title remainder
with emphasis on multichip modules
Contributor
Provider
Publisher
Subject
Genre
Language
eng
Summary
An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs. Also addressed are the critical role of economics and future trends in electronic packaging
Member of
Cataloging source
IEEEE
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.A383 2005
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorDate
  • 1943-
  • 1955-
http://library.link/vocab/relatedWorkOrContributorName
  • IEEE Xplore
  • John Wiley & Sons
  • Institute of Electrical and Electronics Engineers
  • Brown, William D.
  • Ulrich, Richard K.
Series statement
IEEE Press series on microelectronic systems
http://library.link/vocab/subjectName
Microelectronic packaging
Label
Advanced electronic packaging : with emphasis on multichip modules, (electronic resource)
Instantiates
Publication
Note
Made available via IEEE Xplore Digital Library
Bibliography note
Includes bibliographical references and index
Contents
  • Thermal design and management of electronics
  • R.J. Couvillion
  • Mechanical design considerations
  • W.F. Schmidt
  • Packaging trade-offs and decisions
  • L.W. Schaper
  • Computer-aided engineering and design
  • D.L. Andrews ... [et al.]
  • Processing technologies in microelectronic packaging
  • H.A. Naseem
  • Introduction and Overview of microelectronics packaging
  • Materials and processing considerations
  • S.S. Ang and W.D. Brown
  • Reliability considerations
  • R.K. Ulrich
  • Testing and qualification
  • S. Kolluru and D. Berleant
  • Mainframe packaging: the thermal conduction module (TCM)
  • T.G. Lenihan
  • An industry perspective on MCM-D
  • J.C. Demmin
  • W.D. Brown
  • Automotive multichip modules
  • R.W. Johnson and J.L. Evans
  • Analytical techniques for materials characterization
  • S. Nasrazadani, I. Fritsch, and C.S. Henry
  • Cost considerations
  • E.M. Malstrom
  • Advanced topics and future trends in MCM technology
  • J.E. Brewer, W.D. Brown, and S.S. Ang
  • Microelectronics packaging materials and applications
  • W.D. Brown
  • Electrical design considerations
  • S.S. Ang
  • Modeling and simulation
  • L.W. Schaper
Edition
  • 2nd ed. /
  • edited by William D. Brown, Richard K. Ulrich.
Extent
1 online resource.
Form of item
online
Isbn
9780470544082
Specific material designation
remote
Stock number
9780470544082
System control number
  • (OCoLC)557452311
  • (OCoLC)ocn557452311
Label
Advanced electronic packaging : with emphasis on multichip modules, (electronic resource)
Publication
Note
Made available via IEEE Xplore Digital Library
Bibliography note
Includes bibliographical references and index
Contents
  • Thermal design and management of electronics
  • R.J. Couvillion
  • Mechanical design considerations
  • W.F. Schmidt
  • Packaging trade-offs and decisions
  • L.W. Schaper
  • Computer-aided engineering and design
  • D.L. Andrews ... [et al.]
  • Processing technologies in microelectronic packaging
  • H.A. Naseem
  • Introduction and Overview of microelectronics packaging
  • Materials and processing considerations
  • S.S. Ang and W.D. Brown
  • Reliability considerations
  • R.K. Ulrich
  • Testing and qualification
  • S. Kolluru and D. Berleant
  • Mainframe packaging: the thermal conduction module (TCM)
  • T.G. Lenihan
  • An industry perspective on MCM-D
  • J.C. Demmin
  • W.D. Brown
  • Automotive multichip modules
  • R.W. Johnson and J.L. Evans
  • Analytical techniques for materials characterization
  • S. Nasrazadani, I. Fritsch, and C.S. Henry
  • Cost considerations
  • E.M. Malstrom
  • Advanced topics and future trends in MCM technology
  • J.E. Brewer, W.D. Brown, and S.S. Ang
  • Microelectronics packaging materials and applications
  • W.D. Brown
  • Electrical design considerations
  • S.S. Ang
  • Modeling and simulation
  • L.W. Schaper
Edition
  • 2nd ed. /
  • edited by William D. Brown, Richard K. Ulrich.
Extent
1 online resource.
Form of item
online
Isbn
9780470544082
Specific material designation
remote
Stock number
9780470544082
System control number
  • (OCoLC)557452311
  • (OCoLC)ocn557452311

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