The Resource Advanced electronic packaging, (electronic resource)

Advanced electronic packaging, (electronic resource)

Label
Advanced electronic packaging
Title
Advanced electronic packaging
Contributor
Provider
Publisher
Subject
Genre
Language
eng
Summary
Annotation
Member of
Cataloging source
IEEEE
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.A332 2006
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorDate
  • 1955-
  • 1943-
http://library.link/vocab/relatedWorkOrContributorName
  • IEEE Xplore
  • John Wiley & Sons
  • Institute of Electrical and Electronics Engineers
  • Ulrich, Richard K.
  • Brown, William D.
Series statement
IEEE Press series on microelectronic systems
http://library.link/vocab/subjectName
  • Microelectronic packaging
  • Mise sous boîtier (Microélectronique)
  • Mise sous boîtier (Électronique)
Summary expansion
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduatelevel textbook, have been retained.An Instructors Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department
Label
Advanced electronic packaging, (electronic resource)
Instantiates
Publication
Note
  • Made available via IEEE Xplore Digital Library
  • Previous ed.: / William D. Brown. New York: IEEE, 1999
Bibliography note
Includes bibliographical references and index
Color
multicolored
Contents
Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization
Dimensions
unknown
Edition
  • 2nd ed. /
  • edited by Richard K. Ulrich, William D. Brown.
Extent
1 online resource (xxvi, 812 p.)
Form of item
online
Isbn
9780471754503
Other control number
9780471754503
Other physical details
ill.
Specific material designation
remote
Stock number
9780471754503
System control number
  • (OCoLC)731984893
  • (OCoLC)ocn731984893
Label
Advanced electronic packaging, (electronic resource)
Publication
Note
  • Made available via IEEE Xplore Digital Library
  • Previous ed.: / William D. Brown. New York: IEEE, 1999
Bibliography note
Includes bibliographical references and index
Color
multicolored
Contents
Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization
Dimensions
unknown
Edition
  • 2nd ed. /
  • edited by Richard K. Ulrich, William D. Brown.
Extent
1 online resource (xxvi, 812 p.)
Form of item
online
Isbn
9780471754503
Other control number
9780471754503
Other physical details
ill.
Specific material designation
remote
Stock number
9780471754503
System control number
  • (OCoLC)731984893
  • (OCoLC)ocn731984893

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