The Resource Chemical mechanical planarization of microelectronic materials, Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann

Chemical mechanical planarization of microelectronic materials, Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann

Label
Chemical mechanical planarization of microelectronic materials
Title
Chemical mechanical planarization of microelectronic materials
Statement of responsibility
Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
Creator
Contributor
Subject
Language
eng
Summary
  • Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann - all leading CMP pioneers - provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers
  • The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry
Cataloging source
DLC
http://library.link/vocab/creatorName
Steigerwald, Joseph M
Illustrations
illustrations
Index
index present
LC call number
TK7871
LC item number
.S77 1997
Literary form
non fiction
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Murarka, S. P
  • Gutmann, Ronald J
http://library.link/vocab/subjectName
  • Microelectronics
  • Grinding and polishing
  • Chemical mechanical planarization
  • Chemical mechanical planarization
  • Grinding and polishing
  • Microelectronics
  • Materiais e dispositivos semicondutores
Label
Chemical mechanical planarization of microelectronic materials, Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • 5.
  • Oxide CMP Processes -- Mechanisms and Models
  • 6.
  • Tungsten and CMP Processes
  • 7.
  • Copper CMP
  • 8.
  • CMP of Other Materials and New CMP Applications
  • 9.
  • Post-CMP Cleanup
  • 1.
  • Appendix.
  • Problem Sets
  • Chemical Mechanical Planarization -- An Introduction
  • 2.
  • Historical Motivations for CMP
  • 3.
  • CMP Variables and Manipulations
  • 4.
  • Mechanical and Electrochemical Concepts for CMP
Dimensions
24 cm
Extent
xiii, 324 pages
Isbn
9780471138273
Lccn
96006198
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
  • (OCoLC)34285050
  • (OCoLC)ocm34285050
Label
Chemical mechanical planarization of microelectronic materials, Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • 5.
  • Oxide CMP Processes -- Mechanisms and Models
  • 6.
  • Tungsten and CMP Processes
  • 7.
  • Copper CMP
  • 8.
  • CMP of Other Materials and New CMP Applications
  • 9.
  • Post-CMP Cleanup
  • 1.
  • Appendix.
  • Problem Sets
  • Chemical Mechanical Planarization -- An Introduction
  • 2.
  • Historical Motivations for CMP
  • 3.
  • CMP Variables and Manipulations
  • 4.
  • Mechanical and Electrochemical Concepts for CMP
Dimensions
24 cm
Extent
xiii, 324 pages
Isbn
9780471138273
Lccn
96006198
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
  • (OCoLC)34285050
  • (OCoLC)ocm34285050

Library Locations

  • African Studies LibraryBorrow it
    771 Commonwealth Avenue, 6th Floor, Boston, MA, 02215, US
    42.350723 -71.108227
  • Alumni Medical LibraryBorrow it
    72 East Concord Street, Boston, MA, 02118, US
    42.336388 -71.072393
  • Astronomy LibraryBorrow it
    725 Commonwealth Avenue, 6th Floor, Boston, MA, 02445, US
    42.350259 -71.105717
  • Fineman and Pappas Law LibrariesBorrow it
    765 Commonwealth Avenue, Boston, MA, 02215, US
    42.350979 -71.107023
  • Frederick S. Pardee Management LibraryBorrow it
    595 Commonwealth Avenue, Boston, MA, 02215, US
    42.349626 -71.099547
  • Howard Gotlieb Archival Research CenterBorrow it
    771 Commonwealth Avenue, 5th Floor, Boston, MA, 02215, US
    42.350723 -71.108227
  • Mugar Memorial LibraryBorrow it
    771 Commonwealth Avenue, Boston, MA, 02215, US
    42.350723 -71.108227
  • Music LibraryBorrow it
    771 Commonwealth Avenue, 2nd Floor, Boston, MA, 02215, US
    42.350723 -71.108227
  • Pikering Educational Resources LibraryBorrow it
    2 Silber Way, Boston, MA, 02215, US
    42.349804 -71.101425
  • School of Theology LibraryBorrow it
    745 Commonwealth Avenue, 2nd Floor, Boston, MA, 02215, US
    42.350494 -71.107235
  • Science & Engineering LibraryBorrow it
    38 Cummington Mall, Boston, MA, 02215, US
    42.348472 -71.102257
  • Stone Science LibraryBorrow it
    675 Commonwealth Avenue, Boston, MA, 02445, US
    42.350103 -71.103784
Processing Feedback ...