The Resource Copper Electrodeposition for Nanofabrication of Electronics Devices, edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, (electronic resource)

Copper Electrodeposition for Nanofabrication of Electronics Devices, edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, (electronic resource)

Label
Copper Electrodeposition for Nanofabrication of Electronics Devices
Title
Copper Electrodeposition for Nanofabrication of Electronics Devices
Statement of responsibility
edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi
Creator
Contributor
Editor
Provider
Subject
Language
eng
Summary
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners
Member of
http://library.link/vocab/creatorName
Kondo, Kazuo
Image bit depth
0
LC call number
QD551-578
Literary form
non fiction
http://library.link/vocab/relatedWorkOrContributorName
  • Akolkar, Rohan N.
  • Barkey, Dale P.
  • Yokoi, Masayuki.
  • SpringerLink
Series statement
Nanostructure Science and Technology,
http://library.link/vocab/subjectName
  • Chemistry
  • Electronics
  • Nanotechnology
  • Chemistry
  • Electrochemistry
  • Nanotechnology
  • Electronics and Microelectronics, Instrumentation
  • Solid State Physics
Label
Copper Electrodeposition for Nanofabrication of Electronics Devices, edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating
Dimensions
unknown
Extent
VIII, 282 p. 190 illus., 75 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781461491767
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4614-9176-7
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4614-9176-7
Label
Copper Electrodeposition for Nanofabrication of Electronics Devices, edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating
Dimensions
unknown
Extent
VIII, 282 p. 190 illus., 75 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781461491767
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4614-9176-7
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4614-9176-7

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