The Resource Designing TSVs for 3D Integrated Circuits, by Nauman Khan, Soha Hassoun, (electronic resource)

Designing TSVs for 3D Integrated Circuits, by Nauman Khan, Soha Hassoun, (electronic resource)

Label
Designing TSVs for 3D Integrated Circuits
Title
Designing TSVs for 3D Integrated Circuits
Statement of responsibility
by Nauman Khan, Soha Hassoun
Creator
Contributor
Author
Provider
Subject
Language
eng
Summary
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper
Member of
http://library.link/vocab/creatorName
Khan, Nauman
Image bit depth
0
LC call number
TK7888.4
Literary form
non fiction
http://library.link/vocab/relatedWorkOrContributorName
  • Hassoun, Soha.
  • SpringerLink
Series statement
SpringerBriefs in Electrical and Computer Engineering,
http://library.link/vocab/subjectName
  • Engineering
  • Computer science
  • Electronics
  • Systems engineering
  • Engineering
  • Circuits and Systems
  • Processor Architectures
  • Electronics and Microelectronics, Instrumentation
Label
Designing TSVs for 3D Integrated Circuits, by Nauman Khan, Soha Hassoun, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions
Dimensions
unknown
Extent
X, 76 p. 34 illus., 29 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781461455080
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4614-5508-0
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4614-5508-0
Label
Designing TSVs for 3D Integrated Circuits, by Nauman Khan, Soha Hassoun, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions
Dimensions
unknown
Extent
X, 76 p. 34 illus., 29 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781461455080
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4614-5508-0
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4614-5508-0

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