The Resource Factors Governing Tin Whisker Growth, by Erika R Crandall, (electronic resource)

Factors Governing Tin Whisker Growth, by Erika R Crandall, (electronic resource)

Label
Factors Governing Tin Whisker Growth
Title
Factors Governing Tin Whisker Growth
Statement of responsibility
by Erika R Crandall
Creator
Contributor
Author
Provider
Subject
Language
eng
Summary
Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems. This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers
Member of
http://library.link/vocab/creatorName
Crandall, Erika R
Image bit depth
0
LC call number
TK7867-7867.5
Literary form
non fiction
http://library.link/vocab/relatedWorkOrContributorName
SpringerLink
Series statement
Springer Theses, Recognizing Outstanding Ph.D. Research,
http://library.link/vocab/subjectName
  • Physics
  • Systems engineering
  • Materials
  • Surfaces (Physics)
  • Physics
  • Electronic Circuits and Devices
  • Circuits and Systems
  • Metallic Materials
  • Surfaces and Interfaces, Thin Films
  • Surface and Interface Science, Thin Films
Label
Factors Governing Tin Whisker Growth, by Erika R Crandall, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Whiskers and Their Role in Component Reliability -- Film/Substrate Effects on Whisker Growth -- Environmental Effects of Whisker Growth -- Whisker Mitigation and Prevention -- Conclusions
Dimensions
unknown
Extent
XII, 136 p. 92 illus., 65 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9783319004709
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-3-319-00470-9
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-3-319-00470-9
Label
Factors Governing Tin Whisker Growth, by Erika R Crandall, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Whiskers and Their Role in Component Reliability -- Film/Substrate Effects on Whisker Growth -- Environmental Effects of Whisker Growth -- Whisker Mitigation and Prevention -- Conclusions
Dimensions
unknown
Extent
XII, 136 p. 92 illus., 65 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9783319004709
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-3-319-00470-9
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-3-319-00470-9

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