The Resource Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability, Ming He, Toh-Ming Lu, (electronic resource)

Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability, Ming He, Toh-Ming Lu, (electronic resource)

Label
Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability
Title
Metal-dielectric interfaces in gigascale electronics
Title remainder
thermal and electrical stability
Statement of responsibility
Ming He, Toh-Ming Lu
Creator
Contributor
Provider
Subject
Language
eng
Summary
Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design. Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces Features fundamental considerations in the physics and chemistry of metal-dielectric interactions Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics Provides keys to understanding reliability in gigascale electronics Focuses on a dynamic area of current research that is a foundation of future interconnect systems, memristors, and solid-state electrolyte devices Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces
Member of
Cataloging source
GW5XE
http://library.link/vocab/creatorName
He, Ming
Image bit depth
0
LC call number
TK7874
LC item number
.H4 2012
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorDate
1943-
http://library.link/vocab/relatedWorkOrContributorName
  • SpringerLink
  • Lu, T.-M.
Series statement
Springer Series in Materials Science,
Series volume
157
http://library.link/vocab/subjectName
  • Microelectronics
  • Interfaces (Physical sciences)
  • Interfaces (Physical sciences)
  • Microelectronics
  • Physique
  • Astronomie
Label
Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability, Ming He, Toh-Ming Lu, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Bibliography note
Includes bibliographical references and index
Color
not applicable
Contents
Preface -- 1. Introduction -- 2. Metal-Dielectric Diffusion Processes: Fundamentals -- 3. Experimental Techniques -- 4. Al-Dielectric Interfaces -- 5. Cu-Dielectric Interfaces -- 6. Barrier Metal-Dielectric Interfaces -- 7. Self-Forming Barriers. 8. Kinetics of Ion Drift -- 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions
Dimensions
unknown
Extent
1 online resource (xi, 149 p.)
File format
multiple file formats
Form of item
  • online
  • electronic
Isbn
9781461418122
Level of compression
uncompressed
Other physical details
ill. (some col.)
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
  • (OCoLC)768245860
  • (OCoLC)ocn768245860
Label
Metal-dielectric interfaces in gigascale electronics : thermal and electrical stability, Ming He, Toh-Ming Lu, (electronic resource)
Publication
Antecedent source
mixed
Bibliography note
Includes bibliographical references and index
Color
not applicable
Contents
Preface -- 1. Introduction -- 2. Metal-Dielectric Diffusion Processes: Fundamentals -- 3. Experimental Techniques -- 4. Al-Dielectric Interfaces -- 5. Cu-Dielectric Interfaces -- 6. Barrier Metal-Dielectric Interfaces -- 7. Self-Forming Barriers. 8. Kinetics of Ion Drift -- 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions
Dimensions
unknown
Extent
1 online resource (xi, 149 p.)
File format
multiple file formats
Form of item
  • online
  • electronic
Isbn
9781461418122
Level of compression
uncompressed
Other physical details
ill. (some col.)
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
  • (OCoLC)768245860
  • (OCoLC)ocn768245860

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