The Resource More than Moore Technologies for Next Generation Computer Design, edited by Rasit O. Topaloglu, (electronic resource)

More than Moore Technologies for Next Generation Computer Design, edited by Rasit O. Topaloglu, (electronic resource)

Label
More than Moore Technologies for Next Generation Computer Design
Title
More than Moore Technologies for Next Generation Computer Design
Statement of responsibility
edited by Rasit O. Topaloglu
Contributor
Editor
Provider
Subject
Language
eng
Summary
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect
Image bit depth
0
LC call number
TK7888.4
Literary form
non fiction
http://library.link/vocab/relatedWorkOrContributorName
  • Topaloglu, Rasit O.
  • SpringerLink
http://library.link/vocab/subjectName
  • Engineering
  • Computer science
  • Electronics
  • Systems engineering
  • Engineering
  • Circuits and Systems
  • Electronics and Microelectronics, Instrumentation
  • Processor Architectures
Label
More than Moore Technologies for Next Generation Computer Design, edited by Rasit O. Topaloglu, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration
Dimensions
unknown
Extent
IX, 218 p. 116 illus., 63 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781493921638
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4939-2163-8
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4939-2163-8
Label
More than Moore Technologies for Next Generation Computer Design, edited by Rasit O. Topaloglu, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration
Dimensions
unknown
Extent
IX, 218 p. 116 illus., 63 illus. in color.
File format
multiple file formats
Form of item
electronic
Isbn
9781493921638
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-1-4939-2163-8
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-1-4939-2163-8

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