The Resource Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect, by Jie Cheng, (electronic resource)

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect, by Jie Cheng, (electronic resource)

Label
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Title
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Statement of responsibility
by Jie Cheng
Creator
Author
Author
Subject
Language
eng
Summary
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research
Member of
Is part of
http://library.link/vocab/creatorName
Cheng, Jie
http://bibfra.me/vocab/relation/httpidlocgovvocabularyrelatorsaut
vGX7M1IGx-k
Image bit depth
0
LC call number
TS1-2301
Literary form
non fiction
Series statement
Springer Theses, Recognizing Outstanding Ph.D. Research,
http://library.link/vocab/subjectName
  • Manufactures
  • Tribology
  • Corrosion and anti-corrosives
  • Coatings
  • Electronics
  • Microelectronics
  • Manufacturing, Machines, Tools, Processes
  • Tribology, Corrosion and Coatings
  • Electronics and Microelectronics, Instrumentation
Label
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect, by Jie Cheng, (electronic resource)
Instantiates
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Dimensions
unknown
Edition
1st ed. 2018.
Extent
XVIII, 137 p. 103 illus.
File format
multiple file formats
Form of item
electronic
Isbn
9789811061653
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other control number
10.1007/978-981-10-6165-3
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-981-10-6165-3
Label
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect, by Jie Cheng, (electronic resource)
Publication
Antecedent source
mixed
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Dimensions
unknown
Edition
1st ed. 2018.
Extent
XVIII, 137 p. 103 illus.
File format
multiple file formats
Form of item
electronic
Isbn
9789811061653
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other control number
10.1007/978-981-10-6165-3
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
(DE-He213)978-981-10-6165-3

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